Due to the wide-ranging impact of the COVID-19 pandemic, there will be no in-person PACK EXPO event this year. Instead, industrial automation solutions provider Omron Automation Americas will be participating in the live, web-based event “PACK EXPO Connects” event taking place November 9-13, 2020. This event is being organized by the Association for Packaging and Processing Technologies (PMMI) and the PMMI Media Group (PMG) to help the packaging industry stay connected this year.
Omron will be showcasing several market-leading technologies at PACK EXPO Connects, including its recently upgraded FH Series vision system that now includes powerful artificial intelligence (AI) vision tools for advanced defect detection. The FH Series will be part of a pick-and-place demo that also features delta robots and Omron’s highly regarded Sysmac automation platform.
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